BEGO USA | eTechTip


	July 2009 \| Courtesy of BEGO USA
	Stronger Solder Joints Looking to improve the joint strength of your solder connections? Consider locating them in the pontic area. A common technique is to place the solder joint in the interproximal area of the restoration to be joined, since it's easier to cut through this area due to its smaller diameter. By selecting the larger pontic area for the joint, the connection will be stronger by the mere fact of size. By selecting this pontic location the heat is directed away from the margins, preventing any movement. Other important factors to consider for successful connections are: Both joint contact surfaces should be completely cleaned with 110 micron aluminous oxide. Use a thin cutting disc to ensure a small gap between the two pieces of metal. This ensures the capillary action of the hot solder to be pulled through the joint. Once the solder joint is "red hot", relocate the torch on the opposite side of the flowing solder to pull it through the joint. Always use a flux that is matched to your alloy and solder. Once the soldered restoration has cooled, carefully clean the soldering investment out of the copings and finish cleaning the soldered surface with 110 micron aluminous oxide. This will make sure there are no contaminates which could affect the bonding of the ceramics.		By placing the solder connection location in the pontic, a stronger joint is created and helps prevent margin warping by moving the focus of heat away from the margin area

	For more information, call your local dealer or BEGO USA, 1.800.342.2346 www.begousa.com